Scaling Down: Intel Boasts RibbonFET and PowerVia as Next IC Design Solution

Date:2021-08-04 Posted by:coowa View:44

As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.

For more information visit https://www.allaboutcircuits.com/news/scaling-down-intel-boasts-ribbonfet-and-powervia-as-next-ic-design-solution/

BACK
0 Share Collection 0 Comments

Comments: 0

Add a Comment

Please log in to comment.

Login

Enter your email address and password

Forgot Password?

No account ?Click here to register